Author(s): Sanjeev Mane

Abstract:

The integration of advanced PCB design methodologies into modern robotics is accelerating the development of compact, intelligent, and energy-efficient robotic systems. However, this evolution introduces a set of interdependent engineering challenges that impact reliability, performance, and manufacturability. This work consolidates recent advancements and practical solutions across five critical domains: thermal management, signal integrity and EMI/EMC compliance, mechanical robustness under miniaturization and flexible form factors, supply-chain and sustainability constraints, and escalating design complexity driven by autonomous control and heterogeneous sensor integration. Thermal pathways and board layout decisions significantly influence component junction temperatures and overall system lifespan, making thermal-aware placement strategies and novel cooling materials essential for high-density robotic PCBs. Mechanical failures in mobile and industrial robots often correlate with electrical disturbances originating from motors, power rails, and wireless modules—issues exacerbated by inadequate early-stage simulation, grounding schemes, and board-level shielding.

AI-assisted layout, routing, and automated quality-control frameworks enable shorter design cycles while optimizing trace and via positioning for improved signal integrity and thermal dissipation. Emerging trends such as flexible, stretchable, and additively manufactured PCBs unlock new morphologies for soft and wearable robotics, while recyclable and 3D-printed PCB processes reduce material precursors and facilitate integration into constrained assemblies. These developments point toward a hybrid design paradigm—combining physics-based simulation, machine-learning-driven optimization, and advanced materials engineering with design-for-manufacturing principles to deliver robust, high-performance robotic electronics. Finally, we propose a research roadmap emphasizing cross-disciplinary benchmarks, standardized EMC/thermal testing models for robotic platforms, and open datasets to advance reliable AI-driven PCB design technologies.

Keywords: Printed Circuit Board (PCB) Design Integration, Thermal Management, Electromagnetic Interference (EMI/EMC), Flexible and 3D-Printed PCBs, AI-Assisted PCB layout.

DOI: 10.61165/sk.publisher.v12i11.1

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Bridging Electronics and Automation: PCB Design Strategies for Next-Generation Robotics

Pages:1-8